As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...

Stacking glass for high-frequency applications Glass is ideal for 6G wireless communication networks, which must support >100 ...

Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many ...

The case study is about providing a sustainable solution to reduce the failure rate of devices due to clip lifted issues.

Integrating 2D materials into sustainable electronic devices presents key challenges, particularly in depositing or etching ...

Molybdenum is looking increasingly promising as a replacement for a variety of metals commonly used in semiconductor ...

Cadence’s Jasmine Makhija provides an overview of the TEE Device Interface Security Protocol (TDISP), which helps safeguard ...

A new technical paper titled “Automatically Retargeting Hardware and Code Generation for RISC-V Custom Instructions” was ...

IP can no longer be developed and verified outside of the context of the system in which it is expected to operate — unless we develop new verification methodologies.

A Scalable Framework for Resilient Memory Design” was published by researchers at University of Central Florida, University ...

A new technical paper titled “Hardware Acceleration of Kolmogorov-Arnold Network (KAN) in Large-Scale Systems” was published ...

Optimization Pathways for Long-Context Agentic LLM Inference” was published by researchers at University of Cambridge, ...