A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” was published by researchers at Seoul National University of Science and ...
AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...
Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...
A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.
Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for ...
A new technical paper titled “Sensitivity and contrast of indium nitrate hydrate resist evaluated by low-energy electron beam ...
Structured Mixed Precision for Efficient Deep Learning Hardware Codesign” was published by Intel. Abstract “In this paper, we ...
The benefits and tradeoffs of using optics to move data.
The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...
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