Solid-state insertion bonding utilizing nanotwinned copper micro-cone array (nt-Cu MCA) was regarded as a potential solution to the vertical interconnection of chips. It is widely acknowledged that ...

Humans primarily interact with information technology through glass touch screens, and the world would indeed be unrecognizable without glass. However, the low toughness of oxide glasses continues to ...

In summary, the study presented two sulfonamide-based covalent organic frameworks (COFs) incorporated into poly (ethylene oxide) (PEO) for enhanced ionic conduction.