Humans primarily interact with information technology through glass touch screens, and the world would indeed be unrecognizable without glass. However, the low toughness of oxide glasses continues to ...

Solid-state insertion bonding utilizing nanotwinned copper micro-cone array (nt-Cu MCA) was regarded as a potential solution to the vertical interconnection of chips. It is widely acknowledged that ...

We have investigated the chemical bonding character and physicochemical properties of mesoporous zinc oxide-layered titanate nanocomposites synthesized by an exfoliation−restacking route. According to ...

To meet future 3D stacking requirements on wafer-to-wafer level, we successfully demonstrate oxide-oxide direct bonding on 200 mm with and without copper level utilizing face-to-face alignment and ...