“Dan’s deep expertise spans both the semiconductor industry and public sector, bringing a powerful perspective to our ...

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher ...

Applied Materials has purchased nine percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V ...

Infineon Technologies is accelerating the build-up of its system capabilities for software-defined vehicles with the ...

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, has officially unveiled its new fab ...

Infineon Technologies bolsters its global and regional market leadership positions in automotive semiconductors, including ...

IBM and Tokyo Electron (TEL) have announced an extension of their agreement for the joint research and development of ...

Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node.

The Passage M1000 and Passage L200, also announced today, accelerate advances in AI by enabling larger and more capable AI ...

To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete ...

In a further step to enable process and supply chain readiness for high-volume manufacturing of advanced glass substrates and ...

Teradyne has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce ...