A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University. Abstract ...

Such new methodologies enable continuous and direct 2D-to-3D transformations through folding, bending and twisting, with which the occupied space can vary "nonlinearly" by several orders of magnitude ...

In an effort to understand how and why 2D interfaces take on the structures they do, researchers have developed a method to visualize the thermally-induced rearrangement of 2D materials using ...

Researchers 3D print a wormhole… for sound waves Bent plastic in 3D world creates 2D worm hole for sound waves.

In an effort to understand how and why 2D interfaces take on the structures they do, researchers have developed a method to visualize the thermally-induced rearrangement of 2D materials, atom-by-atom, ...